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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11682626 B1

PDFFull Text
Date of Patent:
Jun. 20, 2023

Filed:

Jul. 10, 2020

Chamfered die of semiconductor package and method for forming the same

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chen-Hua Yu, Hsinchu, TW;

Wei-Kang Hsieh, Hsinchu, TW;

Shih-Wei Chen, Hsinchu, TW;

Tin-Hao Kuo, Hsinchu, TW;

Hao-Yi Tsai, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Marcos D Pizarro

Assistant Examiner:

William Henry Anderson

Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/768 (2006.01); H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/56 (2013.01); H01L 21/76802 (2013.01); H01L 23/31 (2013.01); H01L 23/367 (2013.01); H01L 23/4006 (2013.01); H01L 23/4012 (2013.01); H01L 23/5385 (2013.01); H01L 24/14 (2013.01); H01L 25/0657 (2013.01);
Abstract

A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.

Find Patent Forward Citations

Yu, Chen-Hua. (2023). Chamfered die of semiconductor package and method for forming the same (U.S. Patent No. 11682626). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11682626

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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