The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

May. 05, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Sang Ho Yu, Cupertino, CA (US);

Lu Chen, Cupertino, CA (US);

Seshadri Ganguli, Sunnyvale, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); C23C 16/04 (2006.01); C23C 16/455 (2006.01); C23C 16/40 (2006.01); H01L 21/768 (2006.01); C23C 16/34 (2006.01); C23C 16/56 (2006.01);
U.S. Cl.
CPC ...
C23C 16/04 (2013.01); C23C 16/042 (2013.01); C23C 16/34 (2013.01); C23C 16/403 (2013.01); C23C 16/45525 (2013.01); C23C 16/56 (2013.01); H01L 21/76826 (2013.01); H01L 21/76843 (2013.01); H01L 21/76879 (2013.01);
Abstract

Methods for selectively depositing on non-metallic surfaces are disclosed. Some embodiments of the disclosure utilize an unsaturated hydrocarbon to form a blocking layer on metallic surfaces. Deposition is performed to selectively deposit on the unblocked non-metallic surfaces. Some embodiments of the disclosure relate to methods of forming metallic vias with decreased resistance.


Find Patent Forward Citations

Loading…