The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2023
Filed:
Jun. 26, 2020
Intel Corporation, Santa Clara, CA (US);
Kyle Jordan Arrington, Gilbert, AZ (US);
Joseph Blaine Petrini, Gilbert, AZ (US);
Aaron McCann, Chandler, AZ (US);
Shankar Devasenathipathy, Tempe, AZ (US);
James Christopher Matayabas, Jr., Gilbert, AZ (US);
Mostafa Aghazadeh, Chandler, AZ (US);
Jerrod Peterson, Hillsboro, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
To address technical problems facing silicon transient thermal management, a thermal interface material (TIM) may be used to provide improved thermal conduction. The TIM may include a liquid metal (LM) TIM, which may provide a significant reduction in thermal resistance, such as a thermal resistance R≈0.01-0.025° C.-cm2/W. The LM TIM may be applied using a presoaked applicator, such as an open-cell polyurethane foam applicator that has been presoaked in a controlled amount of LM TIM. This LM presoaked applicator is then used to apply the LM TIM to one or more target thermal surfaces, thereby providing thermal and mechanical coupling between the LM TIM and the thermal surface. The resulting thermal surface and thermally conductive LM TIM may be used to improve thermal conduction for various silicon-based devices, including various high-power, high-performance system-on-chip (SoC) packages, such as may be used in portable consumer products.