The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

Dec. 22, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Hiranmay Biswas, Hsinchu, TW;

Chung-Hsing Wang, Hsinchu, TW;

Kuo-Nan Yang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/39 (2020.01); H01L 23/528 (2006.01); G06F 30/398 (2020.01); H01L 27/02 (2006.01); H01L 27/118 (2006.01); G06F 30/36 (2020.01);
U.S. Cl.
CPC ...
G06F 30/398 (2020.01); G06F 30/36 (2020.01); G06F 30/39 (2020.01); H01L 27/0207 (2013.01); H01L 27/11807 (2013.01); H01L 2027/11875 (2013.01); H01L 2027/11881 (2013.01);
Abstract

A semiconductor structure includes a power grid layer (including a first metallization layer) and a set of cells. The first metallization layer includes: conductive first and second portions which provide correspondingly a power-supply voltage and a reference voltage, and which have corresponding long axes oriented substantially parallel to a first direction; and conductive third and fourth portions which provide correspondingly the power-supply voltage and the reference voltage, and which have corresponding long axes oriented substantially parallel to a second direction substantially perpendicular to the first direction. The set of cells is located below the PG layer. Each cell is monostate cell which lacks an input signal and has a single output state. The cells are arranged to overlap at least one of the first and second portions in a repeating relationship with respect to at least one of the first or second portions of the first metallization layer.


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