The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Sep. 22, 2020
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Haruka Sakuma, Yokkaichi, JP;

Hidenori Miyagawa, Yokkaichi, JP;

Shosuke Fujii, Kuwana, JP;

Kiwamu Sakuma, Yokkaichi, JP;

Fumitaka Arai, Yokkaichi, JP;

Kunifumi Suzuki, Yokkaichi Mie, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 27/11597 (2017.01); H01L 29/51 (2006.01); H01L 27/1159 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11597 (2013.01); H01L 27/1159 (2013.01); H01L 29/40111 (2019.08); H01L 29/516 (2013.01);
Abstract

A semiconductor memory device comprises: a substrate; a first semiconductor portion provided separated from the substrate in a first direction intersecting a surface of the substrate, the first semiconductor portion extending in a second direction intersecting the first direction; a first gate electrode extending in the first direction; a first insulating portion which is provided between the first semiconductor portion and the first gate electrode, includes hafnium (Hf) and oxygen (O), and includes an orthorhombic crystal as a crystal structure; a first conductive portion provided between the first semiconductor portion and the first insulating portion; and a second insulating portion provided between the first semiconductor portion and the first conductive portion. An area of a facing surface of the first conductive portion facing the first semiconductor portion is larger than an area of a facing surface of the first conductive portion facing the first gate electrode.


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