The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
Nov. 17, 2020
Stats Chippac Pte. Ltd., Singapore, SG;
HunTeak Lee, Gyeongi-do, KR;
KyungHwan Kim, Incheon, KR;
HeeSoo Lee, Kyunggi-do, KR;
ChangOh Kim, Incheon, KR;
KyoungHee Park, Seoul, KR;
JinHee Jung, Incheon, KR;
OMin Kwon, Gyeonggi-do, KR;
JiWon Lee, Seoul, KR;
YuJeong Jang, Incheon, KR;
STATS ChipPAC Pte. Ltd., Singapore, SG;
Abstract
A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.