The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
Jul. 12, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chih-Hao Chen, Taipei, TW;
Chih-Chien Pan, Taipei, TW;
Li-Hui Cheng, New Taipei, TW;
Chin-Fu Kao, Taipei, TW;
Szu-Wei Lu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method for forming a package structure is provided. The method for forming a package structure includes bonding a package component to a first surface of a substrate through a plurality of first connectors. The package component includes a first semiconductor die and a second semiconductor die. The method also includes forming a dam structure over the first surface of the substrate. The dam structure is around and separated from the package component, and a top surface of the dam structure is higher than a top surface of the package component. The method further includes forming an underfill layer between the dam structure and the package component. In addition, the method includes removing the dam structure after the underfill layer is formed.