The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

May. 02, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Koichi Motoyama, Clifton Park, NY (US);

Oscar van der Straten, Guilderland Center, NY (US);

Joseph F. Maniscalco, Lake Katrine, NY (US);

Alexander Reznicek, Troy, NY (US);

Raghuveer Reddy Patlolla, Guilderland, NY (US);

Theodorus E. Standaert, Clifton Park, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76807 (2013.01); H01L 21/76831 (2013.01); H01L 21/76882 (2013.01); H01L 23/5226 (2013.01); H01L 23/53228 (2013.01);
Abstract

A method including forming a dual damascene interconnect structure comprising a metal wire above a via, recessing the metal wire to form a trench, depositing a liner along a bottom and a sidewall of the trench, and forming a new metal wire in the trench. The method may also include forming a dual damascene interconnect structure comprising a metal wire above a via, recessing the metal wire to form a trench, depositing a liner along a bottom and a sidewall of the trench, removing the liner along the bottom of the trench, and forming a new metal wire in the trench.


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