The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Aug. 05, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masato Shinada, Tokyo, JP;

Hiroyuki Toshima, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01J 37/34 (2006.01); C23C 14/50 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3417 (2013.01); C23C 14/34 (2013.01); C23C 14/505 (2013.01); H01J 37/3429 (2013.01); H01J 37/3435 (2013.01); H01J 37/3447 (2013.01); H01J 2237/026 (2013.01); H01J 2237/20214 (2013.01); H01J 2237/20228 (2013.01); H01J 2237/332 (2013.01); H01L 21/67167 (2013.01); H01L 21/67196 (2013.01); H01L 21/67207 (2013.01); H01L 21/67742 (2013.01);
Abstract

A film-forming apparatus comprises: a processing chamber defining a processing space, a first sputter-particle emitter and a second sputter-particle emitter having targets, respectively, from which sputter-particles are emitted in different oblique directions in the processing space, a sputter-particle blocking plate having a passage hole through which the sputter particles emitted from the first sputter-particle emitter and the second sputter-particle emitter pass, a substrate support configured to support a substrate and provided at a side opposite the first sputter-particle emitter and the second sputter-particle emitter with respect to the sputter-particle blocking plate in the processing space, a substrate moving mechanism configured to linearly move the substrate supported on the substrate support, and a controller configured to control the emission of sputter-particles from the first sputter-particle emitter and the second sputter-particle emitter while controlling the substrate moving mechanism to move the substrate linearly.


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