The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Apr. 13, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Shao-Ting Wu, Hsinchu, TW;

Meng-Sheng Chang, Hsinchu, TW;

Shao-Yu Chou, Hsinchu, TW;

Chung-I Huang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H01L 27/112 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); H01L 27/11206 (2013.01); H01L 21/32139 (2013.01);
Abstract

A fusible structure includes a metal line with different portions having different thicknesses. Thinner portions of the metal line are designed to be destructively altered at lower voltages while thicker portions of the metal line are designed to be destructively altered at lower voltages. Furthermore, one or more dummy structures are disposed proximal to the thinner portions of the metal line. In some embodiments, dummy structures are placed with sufficient proximity so as to protect against metal sputtering when metal line is destructively altered.


Find Patent Forward Citations

Wu, Shao-Ting. (2023). Fusible structures and methods of manufacturing same (U.S. Patent No. 11658114). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11658114

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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