The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Oct. 16, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Akhil Singhal, Portland, OR (US);

Allison Yau, Cupertino, CA (US);

Zeqiong Zhao, Santa Clara, CA (US);

Sang-Jin Kim, San Jose, CA (US);

Zhijun Jiang, San Jose, CA (US);

Deenesh Padhi, Sunnyvale, CA (US);

Ganesh Balasubramanian, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H02N 13/00 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); C25D 7/00 (2013.01); H02N 13/00 (2013.01);
Abstract

Semiconductor processing systems and method are described that may include flowing deposition precursors into a substrate processing region of a semiconductor processing chamber, where the substrate processing region includes an electrostatic chuck. The methods may further include depositing a seasoning layer on the electrostatic chuck from the deposition precursors to form a seasoned electrostatic chuck. The seasoning layer may be characterized by a dielectric constant greater than or about 3.5. The methods may still further include applying a voltage to the seasoned electrostatic chuck of greater than or about 500 V. The seasoned electrostatic chuck may be characterized by a leakage current of less than or about 25 mA when the voltage is applied.


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