The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
Jul. 12, 2019
Applicant:
Versum Materials Us, Llc, Tempe, AZ (US);
Inventors:
Chun Lu, Phoenix, AZ (US);
Xiaobo Shi, Chandler, AZ (US);
Dnyanesh Chandrakant Tamboli, Chandler, AZ (US);
Reinaldo Mario Machado, Phoenix, AZ (US);
Mark Leonard O'Neill, Queen Creek, AZ (US);
Matthias Stender, Phoenix, AZ (US);
Assignee:
VERSUM MATERIALS US, LLC, Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/02 (2006.01); C09G 1/02 (2006.01); C09K 13/00 (2006.01); H01L 21/321 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C09K 13/02 (2013.01); C09G 1/02 (2013.01); C09K 13/00 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01);
Abstract
This invention pertains to slurries, methods and systems that can be used in chemical mechanical planarization (CMP) of tungsten containing semiconductor device. Using the CMP slurries with additives to counter lowering of pH by tungsten polishing byproducts and maintain pH 4 or higher, the erosion of dense metal (such as tungsten) structures can be greatly diminished.