The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

May. 30, 2019
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Toshikazu Nomura, Tokyo, JP;

Masaki Kinoshita, Tokyo, JP;

Nobuyuki Takahashi, Tokyo, JP;

Suguru Sakugawa, Tokyo, JP;

Takashi Kishi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 47/22 (2006.01); B24B 37/005 (2012.01); B24B 37/34 (2012.01); B24B 37/26 (2012.01);
U.S. Cl.
CPC ...
B24B 47/22 (2013.01); B24B 37/005 (2013.01); B24B 37/26 (2013.01); B24B 37/345 (2013.01);
Abstract

A polishing-pad laminated structure which allows for easy alignment of a through-hole of a polishing pad with a sensor head installed in a polishing table is disclosed. The polishing-pad laminated structure includes a polishing pad and a release sheet. The polishing pad has a through-hole located at a position corresponding to a position of a sensor head disposed in the polishing table. The release sheet covers an adhesive surface of the polishing pad. The release sheet is divided into at least a first release sheet and a second release sheet. The first release sheet has a surface area smaller than a surface area of the second release sheet.


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