The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2023
Filed:
Feb. 22, 2022
Intel Corporation, Santa Clara, CA (US);
Sanka Ganesan, Chandler, AZ (US);
Ram Viswanath, Phoenix, AZ (US);
Xavier Francois Brun, Hillsboro, OR (US);
Tarek A. Ibrahim, Mesa, AZ (US);
Jason M. Gamba, Gilbert, AZ (US);
Manish Dubey, Chandler, AZ (US);
Robert Alan May, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic component may include a substrate having a first face and an opposing second face, wherein the substrate includes a through-substrate via (TSV); a first mold material region at the first face, wherein the first mold material region includes a first through-mold via (TMV) conductively coupled to the TSV; and a second mold material region at the second face, wherein the second mold material region includes a second TMV conductively coupled to the TSV.