The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2023

Filed:

Dec. 29, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Tatsuhiro Ueki, Koshi, JP;

Jian Zhang, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G01N 21/95 (2006.01); B05B 12/08 (2006.01); B05C 11/10 (2006.01); G03F 7/16 (2006.01); G01B 11/02 (2006.01); H01L 21/66 (2006.01); B05B 12/12 (2006.01); B05D 1/00 (2006.01); B24B 49/04 (2006.01); G01B 11/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6708 (2013.01); B05B 12/084 (2013.01); B05B 12/12 (2013.01); B05B 12/124 (2013.01); B05C 11/1005 (2013.01); B05D 1/005 (2013.01); B24B 49/045 (2013.01); G01B 11/02 (2013.01); G01B 11/06 (2013.01); G01N 21/9501 (2013.01); G01N 21/9503 (2013.01); G03F 7/162 (2013.01); H01L 21/67051 (2013.01); H01L 21/67253 (2013.01); H01L 21/67288 (2013.01); H01L 22/12 (2013.01); H01L 22/26 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A substrate processing apparatusis configured to supply a processing liquid to a peripheral portion of a wafer W being rotated. The substrate processing apparatusincludes a rotating/holding unitconfigured to rotate and hold the wafer W; a processing liquid discharging unitconfigured to discharge the processing liquid toward the peripheral portion of the wafer W held by the rotating/holding unita variation acquiring unit configured to acquire information upon a variation amount of a deformation of the peripheral portion of the wafer W; and a discharge controllerconfigured to control a discharge angle and a discharge position of the processing liquid from the processing liquid discharging unitonto the peripheral portion based on the information upon the variation amount of the deformation of the peripheral portion acquired by the variation acquiring unit.


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