The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Feb. 01, 2021
Applicant:

Acm Research (Shanghai) Inc., Shanghai, CN;

Inventors:

Hui Wang, Shanghai, CN;

Fuping Chen, Shanghai, CN;

Xi Wang, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/06 (2006.01); C25D 17/00 (2006.01); C25D 5/18 (2006.01); C25D 5/20 (2006.01); C25D 3/02 (2006.01);
U.S. Cl.
CPC ...
C25D 5/18 (2013.01); C25D 3/02 (2013.01); C25D 5/20 (2013.01); C25D 17/06 (2013.01); C25D 17/001 (2013.01);
Abstract

The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.


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