The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2023

Filed:

Apr. 13, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

I-Hsieh Wong, Hsinchu, TW;

Wei-Yang Lee, Taipei, TW;

Feng-Cheng Yang, Hsinchu County, TW;

Yen-Ming Chen, Hsin-Chu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66545 (2013.01); H01L 21/022 (2013.01); H01L 21/02293 (2013.01); H01L 29/0649 (2013.01); H01L 29/511 (2013.01); H01L 29/66553 (2013.01); H01L 29/66636 (2013.01); H01L 29/66795 (2013.01);
Abstract

A semiconductor structure and a method of fabricating thereof is provided. The semiconductor structure may include a plurality of channel layers disposed over a semiconductor substrate, a plurality of metal gate (MGs) each disposed between two channel layers, an inner spacer disposed on a sidewall of each MG, a source/drain (S/D) feature disposed adjacent to the plurality of MGs, and a low-k dielectric feature disposed on the inner spacer, where the low-k dielectric feature extends into the S/D feature. The low-k dielectric feature may include two dissimilar dielectric layers, one of which may be air.


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