The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

Mar. 25, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Seung Hoon Sung, Portland, OR (US);

Jack Kavalieros, Portland, OR (US);

Ian Young, Portland, OR (US);

Matthew Metz, Portland, OR (US);

Uygar Avci, Portland, OR (US);

Devin Merrill, McMinnville, OR (US);

Ashish Verma Penumatcha, Hillsboro, OR (US);

Chia-Ching Lin, Portland, OR (US);

Owen Loh, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); H01L 29/51 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4983 (2013.01); H01L 21/28132 (2013.01); H01L 29/517 (2013.01); H01L 29/6656 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01);
Abstract

Techniques and mechanisms to provide electrical insulation between a gate and a channel region of a non-planar circuit device. In an embodiment, the gate structure, and insulation spacers at opposite respective sides of the gate structure, each extend over a semiconductor fin structure. In a region between the insulation spacers, a first dielectric layer extends conformally over the fin, and a second dielectric layer adjoins and extends conformally over the first dielectric layer. A third dielectric layer, adjoining the second dielectric layer and the insulation spacers, extends under the gate structure. Of the first, second and third dielectric layers, the third dielectric layer is conformal to respective sidewalls of the insulation spacers. In another embodiment, the second dielectric layer is of dielectric constant which is greater than that of the first dielectric layer, and equal to or less than that of the third dielectric layer.


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