The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Jul. 16, 2019
Applicant:

Cabot Microelectronics Corporation, Aurora, IL (US);

Inventors:

William J. Ward, Glen Ellyn, IL (US);

Matthew E. Carnes, Chicago, IL (US);

Ji Cui, Hsin-Chu, TW;

Helin Huang, Aurora, IL (US);

Assignee:

CMC Materials, Inc., Aurora, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C08K 3/22 (2006.01); C09K 13/00 (2006.01); C23F 1/26 (2006.01); H01L 21/306 (2006.01); C23F 3/06 (2006.01); C08L 39/00 (2006.01); C08K 9/00 (2006.01); C08K 3/36 (2006.01); C08K 3/28 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/36 (2013.01); C08K 9/00 (2013.01); C08L 39/00 (2013.01); C09K 13/00 (2013.01); C23F 1/26 (2013.01); C23F 3/06 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/005 (2013.01);
Abstract

The invention relates to a chemical-mechanical polishing composition comprising (a) a first abrasive comprising cationically modified colloidal silica particles, (b) a second abrasive having a Mohs hardness of about 5.5 or more, (c) a cationic polymer, (d) an iron containing activator, (e) an oxidizing agent, and (f) water. The invention also relates to a method of chemically mechanically polishing a substrate, especially a substrate comprising tungsten and barrier layers (e.g., nitrides), with the polishing composition.


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