The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Jun. 04, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Kevin L. Lin, Beaverton, OR (US);

Scott B. Clendenning, Portland, OR (US);

Tristan A. Tronic, Aloha, OR (US);

Urusa Alaan, Hillsboro, OR (US);

Ehren Mannebach, Tigard, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/31053 (2013.01); H01L 21/31144 (2013.01); H01L 21/7682 (2013.01); H01L 21/76802 (2013.01); H01L 21/76819 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/53295 (2013.01);
Abstract

An integrated circuit includes a base comprising an insulating dielectric. A plurality of conductive lines extends vertically above the base in a spaced-apart arrangement, the plurality including a first conductive line and a second conductive line adjacent to the first conductive line. A void is between the first and second conductive lines. A cap of insulating material is located above the void and defines an upper boundary of the void such that the void is further located between the base and the cap of insulating material. In some embodiments, one or more vias contacts an upper end of one or more of the conductive lines.


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