The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Sep. 23, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Abhishek Chowdhury, Bangalore, IN;

Vijayabhaskara Venkatagiriyappa, Bangalore, IN;

Mihaela A. Balseanu, Sunnyvale, CA (US);

Jyoti Prakash Deo, Bangalore, IN;

Srinivas Ramakrishna, Bangalore, IN;

Keiichi Tanaka, San Jose, CA (US);

Mandyam Sriram, San Jose, CA (US);

Francis Kanyiri Mungai, San Jose, CA (US);

Mario D. Silvetti, Morgan Hill, CA (US);

Sriharish Srinivasan, Bangalore, IN;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/687 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); C23C 16/458 (2013.01); H01L 21/68714 (2013.01);
Abstract

Apparatus and methods for vacuum chucking a substrate to a susceptor. The susceptor comprises one or more angularly spaced pockets are positioned around a center axis of the susceptor, the one or more angularly spaced pockets having an inner pocket and an outer pocket. The susceptor can be configured as an intermediate chuck having one or more pucks positioned within the inner pocket or as a distributed chuck having one or more pucks positioned within the outer pocket. The one or more pucks has a center hole, at least one radial channel and at least one circular channel having chuck holes for vacuum chucking a substrate.


Find Patent Forward Citations

Loading…