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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11552069 B1

PDFFull Text
Date of Patent:
Jan. 10, 2023

Filed:

Aug. 31, 2021

Integrated circuit and method of forming the same

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Kuang-Ching Chang, Hsinchu, TW;

Jung-Chan Yang, Hsinchu, TW;

Hui-Zhong Zhuang, Hsinchu, TW;

Chih-Liang Chen, Hsinchu, TW;

Kuo-Nan Yang, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Tomi Skibinski

Int. Cl.
CPC ...
H01L 27/02 (2006.01); G06F 1/3287 (2019.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); G06F 1/3287 (2013.01);
Abstract

An integrated circuit includes a first, second and third power rail, and a header circuit coupled to a gated circuit. The gated circuit is configured to operate on a first or second voltage. The first and second power rail are on a back-side of a wafer, and extend in a first direction. The header circuit is configured to supply the first voltage to the gated circuit by the first power rail. The second power rail is separated from the first power rail in a second direction. The second power rail is configured to supply the second voltage to the gated circuit. The third power rail is on a front-side of the wafer and includes a first set of conductors extending in the second direction, and separated in the first direction. Each of the first set of conductors is configured to supply a third voltage to the header circuit.

Find Patent Forward Citations

Chang, Kuang-Ching. (2023). Integrated circuit and method of forming the same (U.S. Patent No. 11552069). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11552069

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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