The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Nov. 02, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Meng-Hsuan Hsiao, Hsinchu, TW;

Wei-Sheng Yun, Taipei, TW;

Winnie Victoria Wei-Ning Chen, Zhubei, TW;

Tung Ying Lee, Hsinchu, TW;

Ling-Yen Yeh, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 29/423 (2006.01); H01L 29/16 (2006.01); H01L 29/66 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78696 (2013.01); H01L 27/092 (2013.01); H01L 29/0673 (2013.01); H01L 29/16 (2013.01); H01L 29/42392 (2013.01); H01L 29/66545 (2013.01); H01L 29/66742 (2013.01);
Abstract

A method for forming a gate-all-around structure is provided. The method includes forming a plurality of a first type of semiconductor layers and a plurality of a second type of semiconductor layers alternately stacked over a fin. The first type of semiconductor layers includes a first semiconductor layer and a second semiconductor layer, and the first semiconductor layer has a thickness greater than that of the second semiconductor layer. The method also includes removing the second type of semiconductor layers. In addition, the method includes forming a gate to wrap around the first type of semiconductor layers.


Find Patent Forward Citations

Hsiao, Meng-Hsuan. (2023). Method for forming gate-all-around structure (U.S. Patent No. 11545582). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11545582

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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