The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Aug. 30, 2020
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 23/00 (2006.01); C25D 7/12 (2006.01); C25D 21/06 (2006.01); C25D 3/38 (2006.01); C25D 5/02 (2006.01); C25D 21/18 (2006.01);
U.S. Cl.
CPC ...
H01L 24/24 (2013.01); C25D 3/38 (2013.01); C25D 5/02 (2013.01); C25D 7/12 (2013.01); C25D 21/06 (2013.01); C25D 21/18 (2013.01); H01L 24/25 (2013.01); H01L 24/82 (2013.01); H01L 25/18 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24101 (2013.01); H01L 2224/24155 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82106 (2013.01);
Abstract
A semiconductor package, a redistribution structure and a method for forming the same are provided. The redistribution structure for coupling an encapsulated die is provided, the redistribution structure includes a conductive pattern disposed over and electrically coupled to the encapsulated die. The conductive pattern extends beyond an edge of the encapsulated die along a first extending direction which intersects a second extending direction of the edge of the encapsulated die by an angle in a top view, and an impurity concentration of sulfur in the conductive pattern is less than about 0.1 ppm.