The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Feb. 15, 2021
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chao-Hsun Wang, Taoyuan County, TW;

Yu-Feng Yin, Hsinchu County, TW;

Kuo-Yi Chao, Hsinchu, TW;

Mei-Yun Wang, Hsin-Chu, TW;

Feng-Yu Chang, Kaohsiung, TW;

Chen-Yuan Kao, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/085 (2006.01); H01L 29/423 (2006.01); H01L 29/45 (2006.01); H01L 21/28 (2006.01); H01L 29/49 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42364 (2013.01); H01L 21/28026 (2013.01); H01L 29/42372 (2013.01); H01L 29/45 (2013.01); H01L 29/4925 (2013.01); H01L 29/4958 (2013.01); H01L 29/4966 (2013.01); H01L 29/66545 (2013.01); H01L 29/78 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01);
Abstract

A semiconductor structure includes a metal gate structure comprising a gate dielectric layer and a gate electrode, a conductive layer disposed over the metal gate structure, and a contact feature in direct contact with the top portion of the conductive layer, where the conductive layer includes a bottom portion disposed below a top surface of the metal gate structure and a top portion disposed over the top surface of the metal gate structure, and where the top portion laterally extends beyond a sidewall of the bottom portion.


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