The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2022
Filed:
May. 26, 2020
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Jung-Chou Tsai, Hsinchu, TW;
Fong-Yuan Chang, Hsinchu County, TW;
Po-Hsiang Huang, Tainan, TW;
Chin-Chou Liu, Hsinchu County, TW;
Yi-Kan Cheng, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
An interconnect structure includes a plurality of first pads, a plurality of second pads, a plurality of first conductive lines in a first layer, a plurality of second conductive lines in a second layer, and a plurality of nconductive lines in an nlayer. The first pads and the second pads respectively are grouped into a first, a second and an ngroup. Each of the first pads in first group is connected to one of the second pads in the first group by one of the first conductive lines. Each of the first pads in the second group is connected to one of the second pads in the second group by one of the second conductive lines. Each of the first pads in the ngroup is connected to one of the second pads in the ngroup by one of the nconductive lines.