The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2022
Filed:
Sep. 27, 2019
Intel Corporation, Santa Clara, CA (US);
Carl Naylor, Portland, OR (US);
Mauro Kobrinsky, Portland, OR (US);
Richard Vreeland, Beaverton, OR (US);
Ramanan Chebiam, Hillsboro, OR (US);
William Brezinski, Beaverton, OR (US);
Brennen Mueller, Portland, OR (US);
Jeffery Bielefeld, Forest Grove, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Composite integrated circuit (IC) device structures that include two components coupled through a hybrid bonded composite interconnect structure. The two components may be two different monolithic IC structures (e.g., chips) that are bonded over substantially planar dielectric and metallization interfaces. Composite interconnect metallization features formed at a bond interface may be doped with a metal or chalcogenide dopant. The dopant may migrate to a periphery of the composite interconnect structure and form a barrier material that will then limit outdiffusion of a metal, such as copper, into adjacent dielectric material.