The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2022
Filed:
Jan. 21, 2020
Koh Young Technology Inc., Seoul, KR;
Korea Advanced Institute of Science and Technology, Daejeon, KR;
Jong Hwan Kim, Daejeon, KR;
Juyoun Park, Busan, KR;
Ye Won Hwang, Incheon, KR;
Jin Man Park, Daejeon, KR;
Seung Jae Lee, Daejeon, KR;
Tae Min Choi, Seoul, KR;
Yong Ho Yoo, Daejeon, KR;
Duk Young Lee, Suwon-si, KR;
KOH YOUNG TECHNOLOGY INC., Seoul, KR;
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, Daejeon, KR;
Abstract
A substrate inspection apparatus generates, when anomalies of a plurality of second solder pastes among a plurality of first solder pastes printed on a first substrate is detected, at least one image indicating a plurality of second solder pastes with anomalies detected by using an image about a first substrate, applies the at least one image to a machine-learning-based model, acquires a plurality of first values indicating relevance of respective first fault types to the at least one image and a plurality of first images indicating regions associated with one of a plurality of first fault types, determines a plurality of second fault types, which are associated with the plurality of second solder pastes by using the plurality of first values and the plurality of first images, and determines at least one third solder paste, which is associated with the respective second fault types.