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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11515618 B1

PDFFull Text
Date of Patent:
Nov. 29, 2022

Filed:

Apr. 12, 2021

Semiconductor packages and manufacturing methods thereof

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yung-Ping Chiang, Hsinchu County, TW;

Chao-Wen Shih, Hsinchu County, TW;

Shou-Zen Chang, Hsinchu, TW;

Albert Wan, Hsinchu, TW;

Yu-Sheng Hsieh, New Taipei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Jose R Diaz

Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/31 (2006.01); H01Q 21/06 (2006.01); H01Q 1/38 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 23/66 (2006.01); H01Q 9/04 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/768 (2013.01); H01L 23/3107 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/528 (2013.01); H01L 23/66 (2013.01); H01L 24/14 (2013.01); H01L 24/82 (2013.01); H01Q 1/38 (2013.01); H01Q 9/04 (2013.01); H01Q 21/065 (2013.01); H01L 21/568 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/18 (2013.01); H01L 2924/1431 (2013.01);
Abstract

A semiconductor package includes a semiconductor chip and a redistribution layer structure. The redistribution layer structure is arranged to form an antenna transmitter structure and an antenna receiver structure over the semiconductor chip, wherein patterns of the antenna receiver structure are located at different levels of the redistribution layer structure, and at least one pattern of the antenna transmitter structure is at the same level of the topmost patterns of the antenna receiver structure.

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