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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11508655 B1

PDFFull Text
Date of Patent:
Nov. 22, 2022

Filed:

Jan. 08, 2020

Semiconductor package structure and method for manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Yung-Shun Chang, Kaohsiung, TW;

Meng-Wei Hsieh, Kaohsiung, TW;

Teck-Chong Lee, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Dao H Nguyen

Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/56 (2013.01); H01L 21/76871 (2013.01); H01L 23/3107 (2013.01); H01L 23/5283 (2013.01); H01L 24/05 (2013.01); H01L 2224/02371 (2013.01);
Abstract

A semiconductor package structure includes a semiconductor die and at least one pillar structure. The semiconductor die has an upper surface and includes at least one conductive pad disposed adjacent to the upper surface. The pillar structure is electrically connected to the conductive pad of the semiconductor die, and defines a recess portion recessed from a side surface of the pillar structure. A conductivity of the pillar structure is greater than a conductivity of the conductive pad.

Find Patent Forward Citations

Chang, Yung-Shun. (2022). Semiconductor package structure and method for manufacturing the same (U.S. Patent No. 11508655). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11508655

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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