The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2022
Filed:
Oct. 28, 2020
United Microelectronics Corp., Hsin-Chu, TW;
Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, CN;
Li-Wei Feng, Kaohsiung, TW;
Ying-Chiao Wang, Changhua County, TW;
Tzu-Tsen Liu, Kaohsiung, TW;
Tsung-Ying Tsai, Kaohsiung, TW;
Chien-Ting Ho, Taichung, TW;
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, CN;
Abstract
A semiconductor device and method of forming the same, the semiconductor device includes plural bit lines, plural conductive patterns, plural conductive pads and a spacer. The bit lines are disposed on a substrate, along a first direction. The conductive patterns are disposed on the substrate, along the first direction, wherein the conductive patterns and the bit lines are alternately arranged in a second direction perpendicular to the first direction. The conductive pads are arranged in an array and disposed over the conductive patterns and the bit lines. The spacer is disposed between the bit lines and the conductive patterns, under the conductive pads, wherein the spacers includes a tri-layered structure having a first layer, a second layer and a third layer, and the second layer includes a plurality of air gaps separated arranged along the first direction.