The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Aug. 24, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Meng-Han Chou, Hsinchu, TW;

Su-Hao Liu, Jhongpu Township, TW;

Kuo-Ju Chen, Taichung, TW;

Liang-Yin Chen, Hsinchu, TW;

Huicheng Chang, Tainan, TW;

Yee-Chia Yeo, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 29/08 (2006.01); H01L 29/417 (2006.01); H01L 29/45 (2006.01); H01L 21/285 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/3215 (2006.01); H01L 29/66 (2006.01); H01L 23/535 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76895 (2013.01); H01L 21/28518 (2013.01); H01L 21/31111 (2013.01); H01L 21/3215 (2013.01); H01L 21/32133 (2013.01); H01L 21/7684 (2013.01); H01L 21/76805 (2013.01); H01L 21/76829 (2013.01); H01L 21/76892 (2013.01); H01L 23/535 (2013.01); H01L 23/53257 (2013.01); H01L 29/0847 (2013.01); H01L 29/41791 (2013.01); H01L 29/45 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01);
Abstract

A method includes forming a metallic feature, forming an etch stop layer over the metallic feature, implanting the metallic feature with a dopant, forming a dielectric layer over the etch stop layer, performing a first etching process to etch the dielectric layer and the etch stop layer to form a first opening, performing a second etching process to etch the metallic feature and to form a second opening in the metallic feature, wherein the second opening is joined with the first opening, and filling the first opening and the second opening with a metallic material to form a contact plug.


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