The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Nov. 05, 2018
Intel Corporation, Santa Clara, CA (US);
Kelly Lofgreen, Phoenix, AZ (US);
Joseph Petrini, Gilbert, AZ (US);
Todd Coons, Gilbert, AZ (US);
Christopher Wade Ackerman, Phoenix, AZ (US);
Edvin Cetegen, Chandler, AZ (US);
Yang Jiao, Chandler, AZ (US);
Michael Rutigliano, Chandler, AZ (US);
Kuang Liu, Queen Creek, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.