The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Mar. 30, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Christopher A. Rowland, Rockport, MA (US);

Anantha K. Subramani, San Jose, CA (US);

Kasiraman Krishnan, Milpitas, CA (US);

Kartik Ramaswamy, San Jose, CA (US);

Thomas B. Brezoczky, Los Gatos, CA (US);

Swaminathan Srinivasan, Pleasanton, CA (US);

Jennifer Y. Sun, Mountain View, CA (US);

Simon Yavelberg, Cupertino, CA (US);

Srinivas D. Nemani, Sunnyvale, CA (US);

Nag B. Patibandla, Pleasanton, CA (US);

Hou T. Ng, Campbell, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/30 (2021.01); B33Y 30/00 (2015.01); B33Y 10/00 (2015.01); B29C 64/153 (2017.01); B22F 12/00 (2021.01); B33Y 50/02 (2015.01); B23K 10/00 (2006.01); B23K 10/02 (2006.01); B28B 1/00 (2006.01); B22F 10/10 (2021.01); B22F 12/55 (2021.01); B22F 12/63 (2021.01); B22F 12/41 (2021.01); B22F 3/105 (2006.01); H05B 3/00 (2006.01);
U.S. Cl.
CPC ...
B22F 10/30 (2021.01); B22F 12/22 (2021.01); B23K 10/006 (2013.01); B23K 10/027 (2013.01); B28B 1/001 (2013.01); B29C 64/153 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); H05B 3/0061 (2013.01); B22F 10/10 (2021.01); B22F 12/38 (2021.01); B22F 12/41 (2021.01); B22F 12/55 (2021.01); B22F 12/63 (2021.01); B22F 2003/1051 (2013.01); B22F 2998/10 (2013.01);
Abstract

An additive manufacturing system includes a platen to support an object to be fabricated, a dispenser assembly positioned above the platen, and an energy source configured to selectively fuse a layer of powder. The dispenser assembly includes a first dispenser, a second dispenser, and a drive system. The first dispenser delivers a first powder in a first linear region that extends along a first axis, and the second dispenser delivers a second powder in a second linear region that extends parallel to the first linear region and is offset from the first linear region along a second axis perpendicular to the first axis. The drive system a drive system moves the support with the first dispenser and second dispenser together along the second axis.


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