The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Jun. 05, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Andrew James Brown, Phoenix, AZ (US);
Ying Wang, Chandler, AZ (US);
Chong Zhang, Chandler, AZ (US);
Lauren Ashley Link, Mesa, AZ (US);
Yikang Deng, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01F 3/14 (2006.01); H01F 27/06 (2006.01); H01F 41/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01F 3/14 (2013.01); H01F 27/06 (2013.01); H01F 41/02 (2013.01);
Abstract
Disclosed herein are magnetic structures in integrated circuit (IC) package supports, as well as related methods and devices. For example, in some embodiments, an IC package support may include a conductive line and a magnetic structure around a top surface of the conductive line and side surfaces of the conductive line. The magnetic structure may have a tapered shape that narrows toward the conductive line.