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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11439967 B1

PDFFull Text
Date of Patent:
Sep. 13, 2022

Filed:

Aug. 28, 2018

Chemical liquid preparation method, chemical liquid preparation device, and substrate processing device

Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Hajime Nishide, Kyoto, JP;

Takashi Izuta, Kyoto, JP;

Takatoshi Hayashi, Kyoto, JP;

Katsuhiro Fukui, Kyoto, JP;

Koichi Okamoto, Kyoto, JP;

Kazuhiro Fujita, Kyoto, JP;

Atsuyasu Miura, Kyoto, JP;

Kenji Kobayashi, Kyoto, JP;

Sei Negoro, Kyoto, JP;

Hiroki Tsujikawa, Kyoto, JP;

Assignee:

SCREEN Holdings Co., Ltd., Kyoto, JP;

Attorney:

JCIPRNET

Primary Examiner:

Elizabeth Insler

Int. Cl.
CPC ...
B01F 15/04 (2006.01); H01L 21/67 (2006.01); B01F 3/04 (2006.01); B01F 15/00 (2006.01); G05D 21/02 (2006.01); B01F 35/82 (2022.01); H01L 21/306 (2006.01); G05D 11/00 (2006.01); H01L 21/3213 (2006.01); B01F 23/231 (2022.01); B01F 35/21 (2022.01); B01F 35/22 (2022.01); B01F 23/237 (2022.01); B01F 101/58 (2022.01);
U.S. Cl.
CPC ...
B01F 35/82 (2022.01); B01F 23/231 (2022.01); B01F 35/2132 (2022.01); B01F 35/2202 (2022.01); G05D 11/00 (2013.01); G05D 21/02 (2013.01); H01L 21/30608 (2013.01); H01L 21/32134 (2013.01); H01L 21/6708 (2013.01); H01L 21/67017 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/67075 (2013.01); B01F 23/2376 (2022.01); B01F 23/23765 (2022.01); B01F 23/237611 (2022.01); B01F 2101/58 (2022.01);
Abstract

A chemical liquid preparation method of preparing a chemical liquid for treating a film formed on a substrate, including a gas dissolving process in which an oxygen-containing gas and an inert-gas-containing gas are dissolved in the chemical liquid by supplying the oxygen-containing gas which contains oxygen gas and the inert-gas-containing gas which contains an inert gas to a chemical liquid, wherein in the gas dissolving process, a dissolved oxygen concentration in the chemical liquid is adjusted by setting a mixing ratio between the oxygen-containing gas and the inert-gas-containing gas supplied to the chemical liquid as a mixing ratio corresponding to a predetermined target dissolved oxygen concentration.

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