The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Apr. 06, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Wei Wu, San Carlos, CA (US);

Feng Zhang, Campbell, CA (US);

Xiawan Yang, San Jose, CA (US);

Jinhan Choi, Fremont, CA (US);

Anisul Haque Khan, Santa Clara, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/26 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0212 (2013.01); C23C 16/26 (2013.01); C23C 16/45525 (2013.01); C23C 16/50 (2013.01); H01L 21/022 (2013.01); H01L 21/0228 (2013.01); H01L 21/02274 (2013.01);
Abstract

Disclosed herein is a high throughput method for providing directional protection to a three dimensional feature on a substrate by forming a multi-layer amorphous carbon-containing coating with tunable conformality thereon. Forming the multi-layer amorphous carbon-containing coating with tunable conformality includes depositing a base layer onto a horizontal surface of the three dimensional features, and a second layer over the base layer and onto a first portion of a vertical or inclined surface of the three dimensional feature. The base layer includes a first material with a first sticking coefficient and the second layer includes a second material with a second sticking coefficient that is smaller than the first sticking coefficient. The first material includes no fluorine or less fluorine than the second material. Also disclosed herein is a method of manufacturing a three dimensional device as well as three dimensional devices.


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