Company Filing History:
Years Active: 2022
Title: Feng Zhang: Innovator in Amorphous Carbon Coatings
Introduction
Feng Zhang is a prominent inventor based in Campbell, CA (US). He is known for his innovative contributions to the field of materials science, particularly in the development of advanced coatings. His work has significant implications for various applications, including the manufacturing of three-dimensional devices.
Latest Patents
Feng Zhang holds a patent for an invention titled "Amorphous carbon multilayer coating with directional protection." This patent describes a high throughput method for providing directional protection to a three-dimensional feature on a substrate. The method involves forming a multi-layer amorphous carbon-containing coating with tunable conformality. The process includes depositing a base layer onto a horizontal surface of the three-dimensional features, followed by a second layer over the base layer and onto a portion of a vertical or inclined surface. The base layer consists of a first material with a higher sticking coefficient, while the second layer is made from a material with a lower sticking coefficient. This innovative approach enhances the performance and durability of three-dimensional devices.
Career Highlights
Feng Zhang is currently employed at Applied Materials, Inc., where he continues to push the boundaries of materials innovation. His work at the company has been instrumental in advancing technologies that are critical to the semiconductor and nanotechnology industries.
Collaborations
Feng has collaborated with notable colleagues, including Wei Wu and Xiawan Yang. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Feng Zhang's contributions to the field of amorphous carbon coatings exemplify the impact of innovative thinking in materials science. His patent and ongoing work at Applied Materials, Inc. highlight his role as a key player in advancing technology for three-dimensional devices.
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