The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2022

Filed:

Nov. 20, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ruei-Ping Lin, Hsinchu, TW;

Kai-Di Tzeng, Hsinchu, TW;

Chen-Ming Lee, Taoyuan County, TW;

Wei-Yang Lee, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/775 (2006.01); H01L 29/786 (2006.01); H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1033 (2013.01); H01L 29/0673 (2013.01); H01L 29/42392 (2013.01); H01L 29/6656 (2013.01); H01L 29/6681 (2013.01); H01L 29/66439 (2013.01); H01L 29/66545 (2013.01); H01L 29/66818 (2013.01); H01L 29/775 (2013.01); H01L 29/7851 (2013.01); H01L 29/7855 (2013.01); H01L 29/78696 (2013.01); H01L 2029/7858 (2013.01);
Abstract

A semiconductor structure and a method of forming the same are provided. In an embodiment, a semiconductor structure includes a first plurality of channel members over a backside dielectric layer, a second plurality of channel members over the backside dielectric layer, a first gate structure over and wrapping around each of the first plurality of channel members, a second gate structure over and wrapping around each of the second plurality of channel members, and a through-substrate contact that extends between the first plurality of channel members and the second plurality of channel members, between the first gate structure and the second gate structure, and through the backside dielectric layer.


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