The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Aug. 04, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Jerome A. Imonigie, Boise, ID (US);

Guangjun Yang, Meridian, ID (US);

Anish A. Khandekar, Boise, ID (US);

Yoshitaka Nakamura, Boise, ID (US);

Yi Fang Lee, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 29/66 (2006.01); H01L 27/108 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28008 (2013.01); H01L 21/28088 (2013.01); H01L 21/31116 (2013.01); H01L 27/10873 (2013.01); H01L 29/66666 (2013.01);
Abstract

Systems, methods and apparatus are provided for a semiconductor structure. An example method includes a method for forming a contact surface on a vertically oriented access devices. The method includes forming a first source/drain region and a second source/drain region vertically separated by a channel region, forming a sacrificial etch stop layer on a first side of the second source/drain region, wherein the channel region is in contact with a second side of the second source/drain region, forming a dielectric layer on a first side of the sacrificial etch stop layer, where the second source/drain region is connected to a second side of the sacrificial etch stop layer, removing the dielectric layer using a first etch process to expose the sacrificial etch stop layer, and removing the sacrificial etch stop layer using a second etch process to form a contact surface on the second source/drain region.


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