The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

May. 06, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chih-Yuan Yao, Hsinchu, TW;

Yu-Yu Chen, Taichung, TW;

Hsiang-Lung Tsou, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); B08B 5/00 (2006.01); B08B 6/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70741 (2013.01); B08B 5/00 (2013.01); B08B 6/00 (2013.01);
Abstract

A particle removal method includes loading a particle attracting member with a coating layer into a processing chamber of a processing apparatus. The method also includes fixing the particle attracting member on a holder in the processing chamber in a cleaning cycle. The method also includes attracting particles in the processing chamber by the coating layer of the particle attracting member due to a potential difference between the particles and the coating layer. The particles are attracted to the surface of the coating layer. The method further includes loading the particle attracting member with the coating layer and the attracted particles out of the processing chamber, after the cleaning cycle. In addition, the method includes loading a semiconductor wafer into the processing chamber, and performing a semiconductor process on the semiconductor wafer in the processing chamber. The semiconductor process is performed after the cleaning cycle.


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