The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2022
Filed:
Jul. 27, 2020
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Hsuan-Ming Huang, Hsinchu, TW;
An Shun Teng, Hsinchu, TW;
Mingni Chang, Hsinchu, TW;
Ming-Yih Wang, Hsin-Chu, TW;
Yinlung Lu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
The present disclosure provides a method for manufacturing a semiconductor structure. The method includes receiving layout data representing information for manufacturing the semiconductor structure having a metal layer over a substrate. A first parasitic capacitance and a second parasitic capacitance are formed between the metal layer and the substrate. The method further includes determining a parasitic capacitance difference between a first region and a second region. The method further includes forming a dummy capacitor to minimize the parasitic capacitance difference. A system for manufacturing a semiconductor device is also provided.