The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Sep. 13, 2016
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Antonio Xavier, Mulino, OR (US);

Steven Goza, Beavercreek, OR (US);

Ramesh Chandrasekharan, Portland, OR (US);

Adrien LaVoie, Newberg, OR (US);

Joseph Nesmith, Dundee, OR (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/44 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01); H01L 21/02 (2006.01); C23C 16/505 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4405 (2013.01); C23C 16/4408 (2013.01); C23C 16/4412 (2013.01); C23C 16/45536 (2013.01); C23C 16/50 (2013.01); C23C 16/505 (2013.01); H01L 21/0228 (2013.01); H01L 21/02208 (2013.01); H01L 21/02274 (2013.01);
Abstract

A method for reducing effluent buildup in a pumping exhaust system of a substrate processing system includes, during a substrate treatment process, arranging a substrate on a substrate support in a processing chamber; supplying one or more process gases to the processing chamber; supplying an inert dilution gas at a first flow rate to the pumping exhaust system; performing the substrate treatment process on the substrate in the processing chamber; evacuating reactants from the processing chamber using the pumping exhaust system. The method includes, after the substrate treatment process, supplying cleaning plasma including cleaning gas in the processing chamber during a cleaning process; and supplying the inert dilution gas at a second flow rate that is less than the first flow rate to the pumping exhaust system during the cleaning process.


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