The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Aug. 10, 2018
Applicant:
Jsr Corporation, Tokyo, JP;
Inventors:
Goji Wakamatsu, Tokyo, JP;
Naoya Nosaka, Tokyo, JP;
Tsubasa Abe, Tokyo, JP;
Kazunori Sakai, Tokyo, JP;
Yuushi Matsumura, Tokyo, JP;
Hayato Namai, Tokyo, JP;
Assignee:
JSR CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/40 (2006.01); G03F 7/30 (2006.01); G03F 7/09 (2006.01); G03F 7/11 (2006.01); H01L 21/027 (2006.01); G03F 7/26 (2006.01); G03F 7/039 (2006.01);
U.S. Cl.
CPC ...
G03F 7/40 (2013.01); G03F 7/039 (2013.01); G03F 7/091 (2013.01); G03F 7/11 (2013.01); G03F 7/26 (2013.01); G03F 7/30 (2013.01); H01L 21/0271 (2013.01);
Abstract
A composition for resist underlayer film formation, includes a first compound and a solvent. The first compound includes a first group represented by formula (1) and a partial structure comprising an aromatic ring. In the formula (1), Rrepresents a single bond or an oxygen atom, Rrepresents a divalent chain or alicyclic hydrocarbon group having 1 to 30 carbon atoms, and * denotes a bonding site to a moiety other than the first group of the first compound.*—R—R—CN  (1)