The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2022

Filed:

Jan. 08, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masato Kadobe, Oshu, JP;

Shinya Nasukawa, Oshu, JP;

Hiromi Nitadori, Oshu, JP;

Kazuyuki Kikuchi, Oshu, JP;

Hirofumi Kaneko, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/677 (2006.01); F27D 5/00 (2006.01); F27D 7/06 (2006.01); F27D 9/00 (2006.01); F27D 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67173 (2013.01); F27D 3/0084 (2013.01); F27D 5/0037 (2013.01); F27D 7/06 (2013.01); F27D 9/00 (2013.01); H01L 21/67017 (2013.01); H01L 21/67098 (2013.01); H01L 21/67757 (2013.01); F27D 2003/0085 (2013.01); F27D 2009/007 (2013.01);
Abstract

A processing apparatus includes: a plurality of process modules concatenated with one another; and a loader module configured to receive a carrier accommodating a plurality of substrates to be processed by the plurality of process modules, wherein each of the plurality of process modules includes: a heat treatment unit including a processing container configured to accommodate the plurality of substrates and perform a heat treatment on the plurality of substrates; and a gas supply unit disposed on one side surface of the heat treatment unit and configured to supply a gas into the processing container.


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