The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
Sep. 29, 2017
Intel Corporation, Santa Clara, CA (US);
Sujit Sharan, Chandler, AZ (US);
Kemal Aygun, Tempe, AZ (US);
Zhiguo Qian, Chandler, AZ (US);
Yidnekachew Mekonnen, Chandler, AZ (US);
Zhichao Zhang, Chandler, AZ (US);
Jianyong Xie, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods/structures of joining package structures are described. Those methods/structures may include a die disposed on a surface of a substrate, wherein the die comprises a plurality of high density features. An interconnect bridge is embedded in the substrate, wherein the interconnect bridge may comprise a first region disposed on a surface of the interconnect bridge comprising a first plurality of features, wherein the first plurality of features comprises a first pitch. A second region disposed on the surface of the interconnect bridge comprises a second plurality of features comprising a second pitch, wherein the second pitch is greater than the first pitch.