The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Sep. 04, 2013
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Laurent Grenouillet, Rives, FR;

Maud Vinet, Rives, FR;

Romain Wacquez, Marseilles, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/786 (2006.01); H01L 29/423 (2006.01); H01L 29/10 (2006.01); H01L 21/265 (2006.01); H01L 21/28 (2006.01); H01L 21/3065 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66477 (2013.01); H01L 21/2652 (2013.01); H01L 21/28008 (2013.01); H01L 21/3065 (2013.01); H01L 29/0653 (2013.01); H01L 29/1083 (2013.01); H01L 29/4236 (2013.01); H01L 29/42384 (2013.01); H01L 29/66621 (2013.01); H01L 29/66651 (2013.01); H01L 29/66772 (2013.01); H01L 29/7838 (2013.01); H01L 29/7841 (2013.01); H01L 29/78651 (2013.01);
Abstract

A method of production of a field-effect transistor from a stack of layers forming a semiconductor-on-insulator type substrate, the stack including a superficial layer of an initial thickness, made of a crystalline semiconductor material and covered with a protective layer, the method including: defining, by photolithography, a gate pattern in the protective layer; etching the gate pattern into the superficial layer to leave a thickness of the layer of semiconductor material in place, the thickness defining a height of a conduction channel of the field-effect transistor; forming a gate in the gate pattern; forming, in the superficial layer and on either side of the gate, source and drain zones, while preserving, in the zones, the initial thickness of the superficial layer.


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