The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Sep. 17, 2019
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Meng-Sheng Chang, Chu-bei, TW;
Shao-Yu Chou, Chu Pei, TW;
Po-Hsiang Huang, Taipei, TW;
An-Jiao Fu, Hsinchu, TW;
Chih-Hao Chen, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a component having a functionality. The semiconductor device further includes an interconnect structure electrically connected to the component. The interconnect structure is configured to electrically connect the component to a signal. The interconnect structure includes a first column of conductive elements and a second column of conductive elements. The interconnect structure further includes a first fuse on a first conductive level a first distance from the component, wherein the first fuse electrically connects the first column of conductive elements to the second column of conductive elements. The interconnect structure further includes a second fuse on a second conductive level a second distance from the component, wherein the second fuse electrically connects the first column of conductive elements to the second column of conductive elements, and the second distance is different from the first distance.