The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Oct. 10, 2017
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Hiranmay Biswas, Hsinchu, TW;
Chi-Yeh Yu, Hsinchu, TW;
Chung-Hsing Wang, Baoshan Township, TW;
Kuo-Nan Yang, Hsinchu, TW;
Stefan Rusu, Sunnyvale, CA (US);
Chin-Shen Lin, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
An integrated circuit (IC) structure includes a power rail oriented in a power rail direction and first metal segments above the power rail, oriented in a first metal level direction perpendicular to the power rail direction. First vias positioned between the power rail and the first metal segments are positioned at locations where first metal segments overlap the power rail. A second metal segment is positioned above the first metal segments, overlaps the power rail, and is oriented in the power rail direction. Second vias are positioned above the first vias between the first metal segments and the second metal segments, and a power strap is positioned above the second metal segment. The power strap is electrically connected to the power rail, each first metal segment of the plurality of first metal segments has a minimum width, and the power strap has a width greater than a minimum width.