The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Oct. 03, 2016
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Akimasa Kinoshita, Matsumoto, JP;

Yasuyuki Hoshi, Matsumoto, JP;

Yuichi Harada, Matsumoto, JP;

Yasuhiko Oonishi, Nagano, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/78 (2006.01); H01L 21/265 (2006.01); H01L 29/32 (2006.01); H01L 21/02 (2006.01); H01L 21/04 (2006.01); H01L 21/22 (2006.01); H01L 21/304 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/16 (2006.01); H01L 29/36 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 21/266 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7802 (2013.01); H01L 21/02378 (2013.01); H01L 21/02529 (2013.01); H01L 21/02634 (2013.01); H01L 21/049 (2013.01); H01L 21/0475 (2013.01); H01L 21/0485 (2013.01); H01L 21/221 (2013.01); H01L 21/26506 (2013.01); H01L 21/304 (2013.01); H01L 29/0684 (2013.01); H01L 29/0865 (2013.01); H01L 29/1079 (2013.01); H01L 29/1608 (2013.01); H01L 29/32 (2013.01); H01L 29/36 (2013.01); H01L 29/41741 (2013.01); H01L 29/66068 (2013.01); H01L 29/66712 (2013.01); H01L 21/266 (2013.01); H01L 29/0878 (2013.01);
Abstract

A semiconductor device includes an N-type silicon carbide layer, a P-type region, an N-type source region, a P-type contact region, a gate insulating film, a gate electrode, and a source electrode on the front surface side of an N-type silicon carbide substrate. A drain electrode is located on the back surface of the N-type silicon carbide substrate. A life time killer introduction region is located along an entire interface of the N-type silicon carbide layer and the bottom face of the P-type region. The life time killer is introduced by implanting helium or protons from the back surface side of the N-type silicon carbide substrate after forming a surface structure of an element on the front surface side of the N-type silicon carbide substrate and before forming the drain electrode.


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